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CONTENTS
Volume 1, Number 2, July 2012
 

Abstract
Electromigration-induced void evolutions in typical upper and lower layer dual-inlaid Copper (Cu) interconnect structures were simulated by applying a phenomenological model resorting to Monte Carlo based simulations, which considers redistribution of heterogeneously nucleated voids and/or pre-existing vacancy clusters at the Copper/dielectric cap interface during electromigration. The results indicate that this model can qualitatively explain the electromigration-induced void evolutions observations in many studies reported by several researchers heretofore. These findings warrant need to re-investigate technologically important electromigration mechanisms by developing rigorous models based on similar concepts.

Key Words
electromigration in Copper; surface void migration; dual-inlaid Copper interconnect

Address
D.J. Pete: Datta Meghe College of Engineering, Navi Mumbai, India; S.G. Mhaisalkar: School of Materials Engineering, Nanyang Technological University, Singapore; J.B. Helonde: ITM College of Engineering, Nagpur, India; A.V. Vairagar: OMScientific Private Limited, Pune, India

Abstract
The structural and electrical properties of (1-x)Ba(Sm1/2Nb1/2)O3–xBaTiO3; (0

Key Words
ceramics; electronic materials; perovskite; lead-free; electrical properties; permittivity; impedance analysis; electrical conductivity

Address
K. Amar Nath: University Department of Physics, T. M. Bhagalpur University, Bhagalpur - 812 007, India; K. Prasad: Centre for Applied Physics, Central University of Jharkhand, Brambe, Ranchi 835 205, India

Abstract
Polycrystalline diamond is an ideal material for parts with micro-holes and has been widely used as dies and cutting tools in automotive, aerospace and woodworking industries due to its superior wear and corrosion resistance. In this research paper, the modeling and simultaneous optimization of multiple performance characteristics such as material removal rate and surface roughness of polycrystalline diamond (PCD) with ultrasonic machining process has been presented. The fuzzy logic and taguchi\'s quality loss function has been used. In recent years, fuzzy logic has been used in manufacturing engineering for modeling and monitoring. Also the effect of controllable machining parameters like type of abrasive slurry, their size and concentration, nature of tool material and the power rating of the machine has been determined by applying the single objective and multi-objective optimization techniques. The analysis of results has been done using the MATLAB 7.5 software and results obtained are validated by conducting the confirmation experiments. The results show the considerable improvement in S/N ratio as compared to initial cutting conditions. The surface roughness of machined surface has been measured by using the Perthometer (M4Pi, Mahr Germany).

Key Words
fuzzy logic; micro-machining; surface roughness; modeling; optimization; ultrasonic

Address
Vinod Kumar: Department of Mechanical Engineering, Thapar University Patiala, PUNJAB, 147004, India; Neelam kumari: Department of Statistics, Punjabi University Patiala, PUNJAB, 147002, India

Abstract
In the present study, diffusion bonding was carried out between AZ31B magnesium and AA2024 aluminium in the temperature range of 405oC to 475oC for 15 min to 85 min and 5MPa to 20 MPa uniaxial loads was applied. Interface quality of the joints was assessed by microhardness and shear testing. Also, the bonding interfaces were analyzed by means of optical microscopy, scanning electron microscopy, energy dispersive spectrometer and XRD. The maximum bonding and shear strength was obtained at 440oC, 12 MPa and 70 min. The maximum hardness values were obtained from the area next to the interface in magnesium side of the joint. The hardness values were found to decrease with increasing distance from the interface in magnesium side while it remained constant in aluminium side. It was seen that the diffusion transition zone near the interface consists of various phases of MgAl2O4, Mg2SiO4 and Al2SiO5.

Key Words
diffusion bonding; bonding strength; shear strength; micro hardness; OM; SEM; XRD

Address
G. Mahendran: IFET College of Engineering, Gangarampalayam, Villupuram Dt, Tamilnadu, India; V. Balasubramanian: CEMAJOR, Annamalai University, Annamalai Nagar, Chidambaram, Tamilnadu, India; T. Senthilvelan: Podicherry Engineering College, Puducherry, India

Abstract
Nanoflake composite multi core–shell SrFe12O19/Fe3O4/PEG/Polypyrrole was synthesized by in situ polymerization method. In this paper, the fabrication of SrFe12O19 nanoflake is as first core by solgel method. Then fabricated a shell layer from magnetic nanoparticles of Fe3O4, which synthesized by coprecipitation technique, onto the SrFe12O19 nanoflake. Polyethylene glycol (PEG) as a polymer layer and as second shell was coated onto the before core-shell. Than core–shell SrFe12O19/Fe3O4/PEG was used as template for the preparation of SrFe12O19/Fe3O4/PEG/Polypyrrole composite. Final composite has a conductive property among 4.23

Key Words
nanoflake; conductive polymer; magnetic; PPy

Address
Seyed Hossein Hosseini: Department of Chemistry, Faculty of Science, Islamic Azad University, Islamshahr branch, Tehran-Iran; Mohammad Majidpour diz: Department of Chemistry, Faculty of Science, Imam Hossein University, Tehran-Iran


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